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WLCSP breaks ground on an innovation park in SIP

Date:2022-09-23 11:31:21|Source:|Font Size: AAA

China Wafer Level CSP Co Ltd (WLCSP), an SIP-based semiconductor packaging service company, launched the construction on the WLCSP Semiconductor Technology Innovation Park in SIP on Sept 21. The project is expected to drive concentrated innovation of integrate circuit-related technologies in SIP.

WLCSP was founded in SIP in 2005, and went public on the Shanghai Stock Exchange in 2014. In July, it joined hands with Suzhou Industrial Technology Research Institute and SIP Administrative Committee to set up a research institute dedicated to studying on intelligent sensing and interaction technologies, driver assistance and semiconductor devices for vehicles.

The new project is located at Fangzhou Road, with a land area of about 90 mu (6 hectares). With an investment of about RMB 500 million, it will consist of R&D and manufacturing facilities with a total planned floor area of 120,000 square meters. It is scheduled to come into use in 2024.

September 21, 2022

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