China's Semiconductor Industry to Realize "Green Packaging"
The "5th China Semiconductor Packaging and Testing Technology and Market Symposium" was held on May 29, under the joint sponsorship of China Semiconductor Industrial Association, Suzhou Municipal People's Government, The Packaging Branch of China Semiconductor Industrial Association, Sipac, and Suzhou IC Industrial Association.
The symposium was focused on green packaging and an overview of the domestic and overseas packaging and testing technologies and market development trend. An investigation report on China's semiconductor packaging industry was also publicized at the meeting, while fSEMI delivered a report on the global packaging materials and equipment market. The 3-day symposium attracted some 400 professionals from 230 enterprises and institutions.
GMs, managerial personnel and engineers from IC enterprises from SIP took active part in the symposium. AMD and IC China delivered academic lectures and some of the local semiconductor enterprises gave demonstrations of their technologies. Part of the representatives visited Qimonda Technology (Suzhou) Co., Ltd. in SIP.
The symposium offered an exchange platform among enterprises and deepened understanding of the IC industry in SIP and the rest of Suzhou.
June 6, 2007