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Phase-2 Plant of Kulicke & Soffa Commissioned

On Sept. 15, Kulicke & Soffa Semiconductor (Suzhou) Co., Ltd. held an opening ceremony for its new plant of Phase 2, the commencement of package test operation and dicing blades manufacturing. Present at the ceremony were Fang Wenbang, Vice Director of Sipac, Chen Ming, President of SIP Association of Enterprises with Foreign Investment, and Jack Belaini and Oded Lendner, senior VPs of Kulicke & Soffa Company.

Kulicke & Soffa is a leading manufacturer of tools for semiconductor package test in the world. At present, its plant in SIP covers a floor space of 14,200 sq.m. with over 1,000 employees. Its plant for high-magnetic welding rods and testing cards went into operation in September 2003. The currently commissioned Phase 2 plant for package test and dicing blades aims to provide industrial backup for IC manufacturers in China and Asia, and to keep pace with Kulicke & Soffa Group's business strategy in Asia and develop the market across China.

The post-testing is a vital component part in the manufacturing process of semiconductor. The plant of Kulicke & Soffa for package test, a project of 3 million USD investment, is equipped with the most advanced numerically controlled machine tools in the world and to be staffed with over 200 employees by the end of the year. 4 million USD was invested into the plant, to which Kulicke & Soffa has successfully transferred its whole production of dicing blades, with a weekly capacity of 15,000 blades. The plant is intended to develop into a production base for first-rate dicing blades, an engineering R&D base, as well as a global manufacturing center of blades for K&S.

Sept. 20, 2005

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